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Electronic Packaging Guidebook for Managing Silicon Chip Reliability, Book 5, Paperback
GHS 1330
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Guidebook for Managing Silicon Chip Reliability is an exceptional resource for engineers focusing on failure mechanisms and how to manage and avoid damage.
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What Stands Out
Product Details
| Manual & guide type | Instruction Manual |
| Book format | Paperback |
| Edition | 1 |
| Pages | 224 |
| Language | English |
| Brand | Michael Pecht |
| Pub date | 20191007 |
| Author | CRC Press |
| Subgenre | Electrical |
| Genre | Computing & Internet |
| Bisac subject heading | Technology & Engineering |
| Series title | Electronic Packaging |
| Number in series | 5 |
| Height | 9.21 in (23.4 cm) |
| Age group | Adult |
| Retail packaging | Single Piece |
| Original languages | English |
| Item Weight | 1.4 lbs (640 grams) |
Who Should Buy?
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Engineering Students
Ideal for students studying electronics and materials, providing foundational knowledge in silicon chip packaging and reliability.
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Industry Professionals
Beneficial for engineers and technologists working in semiconductor manufacturing needing detailed guidelines for reliability management.
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Research Academics
Useful for researchers focusing on semiconductor reliability, offering insights and methodologies for evaluating packaging techniques.
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General Readers
Not suitable for those without technical background as content is specialized and may be too complex to understand.
Product Description
Electronic Packaging Guidebook for Managing Silicon Chip Reliability, Book 5, Paperback
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Michael Pecht General Circuits Technology & Engineering Books Editorial Review
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GHS 1330
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Features & Benefits
- Comprehensive examination of silicon chip failure mechanisms.
- Offers organized strategies for product design and reliability management.
- Addresses common failure causes and countermeasures.
- Essential quick reference for electrical and mechanical engineers.
- Highlights implications of understanding failure for future developments.
- Practical guidelines for enhancing device reliability through structured approaches.
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